G.SKILL 32GB kit DDR5 6000 CL36 Trident Z5 Neo RGB AMD EXPO

Trident Z5 Neo RGB DDR5 memory is designed for ultra-high overclocked performance on DDR5-enabled AMD platforms. Featuring AMD EXPO overclocking technology for easy memory overclocking on supported AMD platforms, the Trident Z5 Neo RGB series is the ideal choice for building high-performance systems. F5-6000J3636F16GX2-TZ5NR Trident Z5 Neo RGB DDR5-6000 CL36-36-36-96 1.35V 32GB (2x16GB) AMD EXPO Memory Type DDR5 Capacity 32GB (16GBx2) Multi-Channel Kit Dual Channel Kit OC Profile Support AMD EXPO Tested Speed (EXPO) 6000 MT/s Tested Latency (EXPO) 36-36-36-96 Tested Voltage (EXPO) 1.35V Registered/Unbuffered Unbuffered Error Checking (ECC) Non-ECC SPD Speed (Default) 4800 MT/s SPD Voltage (Default) 1.10V Fan Included No Warranty Limited Lifetime Features AMD EXPO Profile Ready Additional Notes Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure. Memory kits that are "Intel XMP 3.0 Ready" / "AMD EXPO Profile Ready" includes support for the respective OC profile. Prior to enabling XMP or EXPO, memory kits will boot at default BIOS settings with compatible hardware. For memory kits with XMP or EXPO, enable XMP/EXPO/DOCP/A-XMP profile in BIOS to reach the rated potential XMP or EXPO overclock speed of the memory kit, subject to the use of compatible hardware. Please refer to the "How to Enable XMP/EXPO" guide. Reaching the rated XMP/EXPO overclock speed and system stability will depend on the compatibility and capability of the motherboard and CPU used. Usage in any manner inconsistent with manufacturer specifications, warnings, designs, or recommendations will result in lower speeds, system instability, or damage to the system or its components. Memory module height can be found in the FAQ, under the question "How tall are the memory modules?". For product support and related questions, please contact the G.SKILL technical support team via email.